Alternate Title

Machine Vision System for Metal Film Metrology Tool

Contributor(s)

Wilson, Bruce, Kowalski, Gregory

Abstract

The integrated circuit fabrication industry requires a nondestructive inspection method that can measure three dimensional features etched in thin metal films on silicon wafers. Accurately measuring the thickness of these metal films to angstrom repeatability was a problem that industry had struggled with for decades. Current processes can only destructively measure blank or unetched wafers. This results in the disposal of millions of dollars worth of blank wafer each year. A thin film metrology tool, known as the Impulse 300 (TM) from Philips Analytical, uses a nondestructive laser based method of measuring thin metal films on blank wafers. The instrument is capable of measuring etched wafers, however it has no way of pinpointing the various features on etched wafers. This report presents a detailed engineering solution for a vision system that has been retrofitted into the existing Impulse 300 (TM).

Notes

Capstone Design Course, Project #S99, Final report

Keywords

inspection methods, metrology tool

Publisher

Northeastern University

Publication Date

8-27-2007

Rights Holder

Northeastern University, Department of Mechanical, Industrial and Manufacturing Engineering

Permanent URL

http://hdl.handle.net/2047/d10010749


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