Abstract
The latest enhancements in industrial technologies, especially the ones in electronics industry, have provided organizations with the ability to manufacture faster and more economical products. This fact, coupled with the growing interest and demand for the latest technology, have led electronic equipment manufacturers to start producing ""high-tech"" and ""personalized"" products at an increasing rate. This has led to a high rate of obsolescence for electronic products worldwide, even though the majority of these ""obsolete"" products still function. In this paper, we investigate a product recovery facility where the end-of-life (EOL) products are taken back from the last users and are brought into the facility for processing. We assume that there are multiple types of EOL products and that a combination of these can be disassembled to provide for a sufficient number of demanded components and materials. We then present a data envelopment analysis (DEA) algorithm to determine the number and types of the EOL products that will be required to fulfill the demand. A numerical example is presented to demonstrate the functionality of the methodology.
Keywords
End-of-Life Processing, Data Envelopment Analysis, Product Recovery
Subject Categories
Recycling (Waste (etc.)), Production engineering
Disciplines
Engineering
Publisher
SPIE
Publication Date
2003
Rights Information
Copyright 2003, Society of Photo-Optical Instrumentation Engineers.
Restrictions
One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Rights Holder
Society of Photo-Optical Instrumentation Engineers.
Permanent URL
Recommended Citation
Kongar, Nuriye Elif; Gupta, Surendra M.; and McGovern, Seamus M., "Use of data envelopment analysis for product recovery" (2003). . Paper 118. http://hdl.handle.net/2047/d10003198
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Notes
Presented at the SPIE International Conference on Environmentally Conscious Manufacturing III, Providence, Rhode Island, October 29-30, 2003.