Abstract
By using optical lithographic procedures, the authors present a micromachined platform for large scale three dimensional (3D) assembly of gold nanoparticles with diameters of ∼ 50 nm. The gold nanoparticles are formed into 3D low resistance bridges (two terminal resistance of ∼ 40 Ω) interconnecting the two microelectrodes using ac dielectrophoresis. The thickness of the parylene interlevel dielectric can be adjusted to vary the height of the 3D platform for meeting different application requirements. This research represents a step towards realizing high density, three dimensional structures and devices for applications such as nanosensors, vertical integration of nanosystems, and characterization of nanomaterials.
Keywords
nanoparticles, lithography, gold, electrophoresis
Subject Categories
Nanoparticles, Microelectromechanical systems
Disciplines
Electrical and Electronics | Nanoscience and Nanotechnology
Publisher
American Institute of Physics
Publication Date
2-21-2007
Rights Information
Copyright 2007
Rights Holder
American Institute of Physics
Permanent URL
Recommended Citation
Khanduja, Nishant; Selvarasah, Selvapraba; Chen, Chia-Ling; Dokmeci, Mehmet R.; Xiong, Xugang; Makaram, Prashanth; and Busnaina, Ahmed A., "Three dimensional controlled assembly of gold nanoparticles using a micromachined platform" (2007). Center for High-Rate Nanomanufacturing Publications. Paper 11. http://hdl.handle.net/2047/d20000922
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Figure 2- high resolution image
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Figure 3 - high resolution image
COinS
Notes
Originally published in Applied Physics Letters, v.90, 083105 (2007); doi:10.1063/1.2679882